Omron Introduces VT-X850: The Next Generation 3D CT X-Ray Inspection System for EV SMT Manufacturing Lines
May 7, 2024
Omron introduces VT-X850, an inspection system with advanced features such as true 3D imaging, enhanced sample handling, and automated algorithms, ensuring the highest quality solder joints for critical EV assemblies.
Omron Automation Americas, a global leader in industrial automation solutions, announces the launch of the VT-X850, a cutting-edge 3D CT X-Ray inspection system specifically designed to meet the needs of electric vehicle (EV) applications and other similar products. This advanced machine offers unparalleled capabilities to ensure these critical assemblies are produced with the highest quality solder joints.
Key Features of the VT-X850:
- True 3D CT X-Ray Inspection: With over 300 cross-section images, the VT-X850 provides comprehensive analysis of each solder joint to easily and reliably identify a wide of quality concerns.
- Enhanced Sample Handling: Equipped with enhanced product clearances, larger loading doors and stronger conveyors to allow for the inspection of heavy and thick samples commonly found in EV manufacturing.
- High-Powered X-Ray Tube: The 160kV closed tube enables X-Rays to penetrate thick samples or substrates with metal enclosures, producing images with excellent contrast and minimal interference.
- Fast and Efficient: High-speed, CT designed to operate in-line with other SMT equipment, minimizing interruptions to production.
- Seamless Integration: Supports industry standards such as SMEMA, IPC-CFX, and Hermes, ensuring compatibility with a variety of other machines.
- Automated Algorithms: Improves repeatability and reduces the inspection workload for engineers, eliminating the subjective approach of manual inspection.
- Maintenance-Free: The closed-tube X-Ray source used in the VT-X850 minimizes production downtime and reduces opportunities for human error.
More Information
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